Hauv cov txheej txheem ntim khoom siv hluav taws xob, ceramic substrates yog cov khoom tseem ceeb. Txo qhov tsis xws luag ntawm ceramic substrates yog qhov tseem ceeb rau kev txhim kho cov khoom siv hluav taws xob zoo. Txawm li cas los xij, tam sim no tsis muaj lub teb chaws lossis cov qauv kev lag luam rau kev kuaj kev ua haujlwm ceramic substrate, uas ua rau muaj kev nyuaj rau kev lag luam thiab kev txhawb nqa khoom.
Tam sim no, cov ntsuas kev ua haujlwm tseem ceeb suav nrog cov duab hauv qab, cov khoom siv kho tshuab, cov khoom siv thermal, cov khoom siv hluav taws xob, kev ntim khoom (kev ua haujlwm), thiab kev ntseeg tau.
Kev tshuaj xyuas qhov tshwm sim
Ceramic substrate zoo li kev tshuaj xyuas feem ntau siv kev tshuaj xyuas qhov muag lossis kho qhov muag microscopy. Cov khoom tshuaj ntsuam xyuas muaj xws li seb cov ceramic substrate puas muaj cov kab nrib pleb lossis voids, thiab seb cov hlau txheej saum npoo puas muaj khawb, tev, lossis stains. Tsis tas li ntawd, qhov ntev ntawm cov ceramic substrate, thickness ntawm cov hlau txheej, nto flatness (warpage) ntawm lub substrate, thiab qhov tseeb ntawm lub substrate nto qauv yog txhua yam tseem ceeb uas yuav tsum tau ua tib zoo tshuaj xyuas. Tshwj xeeb tshaj yog rau flip-chip thiab siab- ntim ntim, qhov chaw tiaj tus feem ntau yuav tsum tsawg dua 0.3%.
Nyob rau hauv xyoo tas los no, nrog kev txhim kho txuas ntxiv ntawm kev siv tshuab computer thiab cov duab ua thev naus laus zis, thiab kev nce nqi zog rau cov lag luam, cov tuam txhab tau tsom mus rau kev siv cov cuab yeej txawj ntse thiab tshuab pom kev thev naus laus zis hauv kev hloov pauv thiab txhim kho kev tsim khoom. Lub zeem muag ntawm lub tshuab-raws li kev tshawb nrhiav thiab cov cuab yeej siv tau maj mam dhau los ua ib qho tseem ceeb hauv kev txhim kho cov khoom zoo thiab ua kom muaj txiaj ntsig. Yog li ntawd, siv cov cuab yeej siv lub tshuab pom kev tshawb pom rau kev tshuaj xyuas cov khoom siv hluav taws xob tuaj yeem txhim kho kev tshawb pom, txo cov nqi zog, thiab muaj txiaj ntsig zoo.
Mechanical Performance Testing
Cov khoom siv ntawm cov khoom siv ceramic feem ntau yog hais txog lub zog sib txuas ntawm cov hlau Circuit Court txheej, uas sawv cev rau lub zog adhesion ntawm cov hlau txheej thiab ceramic substrate, thiab ncaj qha txiav txim siab qhov zoo ntawm cov khoom ntim tom ntej (tuag lub zog thiab kev ntseeg tau, thiab lwm yam). Lub zog sib txuas ntawm ceramic substrates npaj los ntawm ntau txoj kev sib txawv heev. Planar ceramic substrates npaj siv high - cov txheej txheem kub (xws li TPC, DBC, thiab lwm yam) muaj lub zog sib txuas ntau dua vim tias cov hlau txheej thiab cov ceramic substrate txuas nrog cov khoom siv tshuaj. Txawm li cas los xij, ceramic substrates npaj siv qis- cov txheej txheem kub (xws li DPC substrates) feem ntau tso siab rau van der Waals cov tub rog thiab cov khoom siv sib cuam tshuam, uas ua rau muaj kev sib txuas qis dua.
Cov kev sim rau metallization zog ntawm ceramic substrates muaj xws li:
[Duab]
Schematic daim duab ntawm shear zog xeem / tensile lub zog xeem
(1) Daim kab xev txoj kev: Ib daim kab xev yog ruaj khov rau saum npoo ntawm cov hlau txheej, thiab cov menyuam roj hmab yog siv los yob hla nws kom tshem tawm cov npuas npuas hauv qhov chaw sib txuas. Tom qab 10 vib nas this, ib tug quab yuam perpendicular rau cov hlau txheej yog siv los tev tawm daim kab xev, thiab nws yog xyuas seb cov hlau txheej tev tawm ntawm lub substrate. Kev xeem daim kab xev yog ib txoj kev xeem zoo.
(2) Txoj kev sib txuas ntawm cov hlau: Cov hlau hlau uas muaj txoj kab uas hla ntawm 0.5 hli lossis 1.0 hli raug xaiv thiab ncaj qha welded rau cov hlau txheej ntawm lub substrate los ntawm melting solder. Tom qab ntawd, lub ntsuas hluav taws xob yog siv los ntsuas qhov rub - tawm ntawm lub zog ntawm cov hlau hlau nyob rau hauv txoj kab ntsug.
(3) Peel lub zog txoj kev: Cov hlau txheej ntawm qhov chaw ntawm ceramic substrate yog etched (txiav) rau hauv 5 mm mus rau 10 mm ntev strips, thiab ces tev tawm nyob rau hauv txoj kev ntsug siv lub tev lub zog tester los ntsuas nws tev lub zog. Lub tev ceev yuav tsum yog 50 mm / min, thiab ntsuas zaus yog 10 zaug / s.
Thermal Performance
Kev ua haujlwm thermal ntawm ceramic substrates feem ntau suav nrog thermal conductivity, tshav kub tsis kam, thermal expansion coefficient, thiab thermal kuj. Ceramic substrates feem ntau ua si lub luag haujlwm ntawm cov cua sov hauv cov khoom ntim, yog li lawv cov thermal conductivity yog ib qho tseem ceeb qhia kev; Thaum tshav kub kub ua haujlwm feem ntau yog kuaj seb puas yog ceramic substrate warps los yog deforms ntawm qhov kub thiab txias, seb puas yog cov hlau hauv Circuit Court txheej oxidizes, discolors, hlwv, los yog delaminates, thiab seb lub sab hauv los ntawm - qhov tsis.
Cov yam ntxwv ntawm thermal conductivity ntawm ceramic substrates tsis yog tsuas yog cuam tshuam nrog thermal conductivity ntawm ceramic substrate khoom (bulk thermal resistance), tab sis kuj muaj feem xyuam nrog cov khoom sib txuas (interface contact thermal resistance). Yog li ntawd, siv lub thermal resistance tester (uas tuaj yeem ntsuas qhov thermal resistance thiab interface thermal resistance ntawm ntau- txheej txheej) tuaj yeem ntsuas qhov thermal conductivity ntawm ceramic substrates.
Hluav taws xob Performance
Kev ua haujlwm hluav taws xob ntawm cov khoom siv hluav taws xob feem ntau yog hais txog seb cov hlau txheej nyob rau sab pem hauv ntej thiab sab nraub qaum ntawm lub substrate yog conductive (txawm tias sab hauv los ntawm - qhov zoo yog qhov zoo). Vim yog qhov me me ntawm txoj kab uas hla ntawm - qhov hauv DPC ceramic substrates, qhov tsis xws luag xws li kev ua tsis tiav thiab huab cua voids yuav tshwm sim thaum electroplating. Feem ntau, ib qho X-ray tester (zoo, ceev) thiab lub davhlau ya nyob twg (quantitative, pheej yig) tuaj yeem siv los ntsuas qhov zoo ntawm qhov dhau los ntawm - qhov hauv ceramic substrates.
Ntim Kev Ua Haujlwm
Kev ntim khoom ntawm ceramic substrates feem ntau yog hais txog solderability thiab airtightness (tso rau peb -seem ntawm ceramic substrates). Txhawm rau txhim kho cov hlau sib txuas lub zog, txheej ntawm Au lossis Ag lossis lwm cov hlau uas muaj cov khoom siv vuam zoo feem ntau yog electroplated lossis chemically plated rau saum npoo ntawm ceramic substrate hlau txheej (tshwj xeeb tshaj yog cov ntaub qhwv) los tiv thaiv oxidation thiab txhim kho cov hlau sib txuas zoo. Solderability feem ntau yog ntsuas los ntawm kev siv lub tshuab aluminium hlau thiab lub tensile tester.
Lub nti yog mounted nyob rau hauv kab noj hniav ntawm ib tug peb -dimensional ceramic substrate, thiab cov kab noj hniav yog kaw nrog ib tug cover phaj (hlau los yog iav) kom ua tiav hermetic ntim ntawm lub cuab yeej. Lub hermeticity ntawm lub pas dej ua ke thiab cov khoom siv vuam ncaj qha txiav txim siab lub hermeticity ntawm lub ntim khoom, thiab lub hermeticity ntawm peb -qhov loj ntawm ceramic substrates npaj los ntawm ntau txoj kev sib txawv rau qee qhov. Cov kev ntsuam xyuas tseem ceeb rau peb - qhov ntev ceramic substrates tsom mus rau lub hermeticity ntawm cov khoom siv thiab cov qauv, feem ntau yog siv cov txheej txheem fluorocarbon roj npuas thiab cov txheej txheem helium mass spectrometer.